● Layanan Kita: Layanan manufaktur elektronik PCB lan PCBA siji-mandeg
● Layanan manufaktur PCB: Perlu file Gerber (CAM350 RS274X), file PCB (Protel 99, AD, Eagle), lsp
● Layanan sumber komponen: Dhaptar BOM kalebu nomer Part lan Designator sing rinci
● layanan Déwan PCB: File ndhuwur lan Pick lan Panggonan file, drawing Déwan
● Programming & Testing services: Program, instrouction and test method etc.
● Layanan perakitan omah: file 3D, langkah utawa liyane
● Layanan reverse engineering: Sampel lan liya-liyane
● Layanan perakitan kabel & kabel: Spesifikasi & liyane
● Layanan liyane: Layanan tambah nilai
Kapasitas Teknis PCB
Lapisan | Produksi massal: 2 ~ 58 lapisan / Pilot run: 64 lapisan |
Maks.kekandelan | Produksi massal: 394mil (10mm) / Pilot run: 17,5mm |
Bahan | FR-4 (Standar FR4, Mid-Tg FR4, Hi-Tg FR4, Bahan perakitan bebas timah), Bebas Halogen, diisi Keramik, Teflon, Polimida, BT, PPO, PPE, Hibrida, Hibrida parsial, lsp. |
Min.Jembar / Spasi | Lapisan njero: 3mil/3mil (HOZ), Lapisan njaba: 4mil/4mil(1OZ) |
Maks.Ketebalan Tembaga | Sertifikat UL: 6.0 OZ / Pilot run: 12OZ |
Min.Ukuran bolongan | Bor mekanik: 8mil(0.2mm) Laser bor: 3mil(0.075mm) |
Maks.Ukuran Panel | 1150mm × 560mm |
Rasio aspek | 18:1 |
Lumahing Rampung | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
Proses Khusus | Lubang Terkubur, Lubang Buta, Resistansi Tertanam, Kapasitas Tertanam, Hibrida, Hibrida parsial, Kapadhetan dhuwur parsial, pengeboran mburi, lan kontrol Resistance |
Kapasitas Teknis PCB
SMT | Akurasi posisi: 20 um |
Ukuran komponen: 0,4 × 0,2mm (01005) —130 × 79mm, Flip-CHIP, QFP, BGA, POP | |
Maks.dhuwur komponen:: 25mm | |
Maks.Ukuran PCB: 680 × 500mm | |
Min.Ukuran PCB: ora winates | |
Ketebalan PCB: 0.3-6mm | |
PCB bobot: 3KG | |
Gelombang-Solder | Maks.Jembaré PCB: 450mm |
Min.Jembar PCB: ora winates | |
Dhuwur komponen: Ndhuwur 120mm / Bot 15mm | |
Kringet-Solder | Tipe logam: part, wutuh, inlay, sidestep |
Bahan logam: Tembaga, Aluminium | |
Rampung lumahing: plating Au, plating sliver, plating Sn | |
Tingkat kandung kemih udara: kurang saka 20% | |
Tekan-fit | Rentang tekan: 0-50KN |
Maks.Ukuran PCB: 800x600mm | |
Testing | ICT, Probe flying, burn-in, tes fungsi, siklus suhu |