Papan PCBA Ponsel
Fitur produk
● -HDI / Sembarang lapisan / mSAP
● -Fine line lan kemampuan Pabrik multilayer
● -Advanced SMT lan sawise peralatan Déwan
● -Kerajinan kepileh
● -kapabilitas test fungsi terisolasi
● -Materi mundhut Low
● -5G Pengalaman Antena
Layanan Kita
● Layanan Kita: Layanan manufaktur elektronik PCB lan PCBA siji-mandeg
● Layanan manufaktur PCB: Perlu file Gerber (CAM350 RS274X), file PCB (Protel 99, AD, Eagle), lsp
● Layanan sumber komponen: Dhaptar BOM kalebu nomer Part lan Designator sing rinci
● layanan Déwan PCB: File ndhuwur lan Pick lan Panggonan file, drawing Déwan
● Programming & Testing services: Program, instrouction and test method etc.
● Layanan perakitan omah: file 3D, langkah utawa liyane
● Layanan reverse engineering: Sampel lan liya-liyane
● Layanan perakitan kabel & kabel: Spesifikasi & liyane
● Layanan liyane: Layanan tambah nilai
Kapasitas Teknis PCB
| Lapisan | Produksi massal: 2 ~ 58 lapisan / Pilot run: 64 lapisan |
| Maks. kekandelan | Produksi massal: 394mil (10mm) / Pilot run: 17,5mm |
| Materi | FR-4 (Standar FR4, Mid-Tg FR4, Hi-Tg FR4, Bahan perakitan bebas timah), Bebas Halogen, Keramik diisi, Teflon, Polimida, BT, PPO, PPE, Hibrida, Hibrida parsial, lsp. |
| Min. Jembar / Spasi | Lapisan njero: 3mil/3mil (HOZ), Lapisan njaba: 4mil/4mil(1OZ) |
| Maks. Ketebalan Tembaga | Sertifikat UL: 6.0 OZ / Pilot run: 12OZ |
| Min. Ukuran bolongan | Bor mekanik: 8mil(0.2mm) Laser bor: 3mil(0.075mm) |
| Maks. Ukuran Panel | 1150mm × 560mm |
| Rasio aspek | 18:1 |
| Lumahing Rampung | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Proses Khusus | Lubang Terkubur, Lubang Buta, Resistansi Tertanam, Kapasitas Tertanam, Hibrida, Hibrida parsial, Kapadhetan dhuwur parsial, pengeboran mburi, lan kontrol Resistance |
